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US 2026/0269192 A1Published application
Edge ring for semiconductor manufacturing apparatus and manufacturing method therefor
AssigneeTokai Carbon Korea Co., Ltd
InventorJin Won SEO
Life of this patent
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Abstract
Disclosed herein are an edge ring for a semiconductor manufacturing apparatus and a manufacturing method therefor. The edge ring for a semiconductor manufacturing apparatus includes: an upper layer having high hardness; and a lower layer positioned below the upper layer and having lower hardness than the upper layer, where the lower layer may be positioned to be in contact with an internal component of a plasma etching apparatus.
Claims21
An edge ring comprising:
- an upper layer having high hardness;
- and
- a lower layer positioned on a lower portion of the upper layer and having lower hardness than the upper layer,
- wherein the lower layer is positioned to be in contact with an internal component of a plasma etching apparatus.
1 more element
A method of manufacturing an edge ring, the method comprising:
- forming a high-hardness upper layer;
- forming a lower layer having lower hardness than the upper layer;
- and
- processing in a component form.
1 more element
Dependencies are inferred from the claim text.