H01J 2237/327
Arrangements for generating the plasma
H01J2237/327 (Arrangements for generating the plasma) appears on 308 US grants and 454 published applications in this corpus.
Search patents in H01J- Granted patents
- 308
- Published applications
- 454
- Assignees
- 137
- Inventors
- 957
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 4 |
| 2011 | 2 | 3 |
| 2012 | 0 | 6 |
| 2013 | 1 | 7 |
| 2014 | 9 | 17 |
| 2015 | 10 | 30 |
| 2016 | 28 | 41 |
| 2017 | 21 | 43 |
| 2018 | 23 | 25 |
| 2019 | 44 | 40 |
| 2020 | 26 | 25 |
| 2021 | 23 | 22 |
| 2022 | 16 | 25 |
| 2023 | 19 | 50 |
| 2024 | 31 | 58 |
| 2025 | 28 | 38 |
| 2026 | 27 | 15 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Film forming method and film forming apparatus6 Oct 2026US 12,753,485 B2Tokyo Electron Limited
- Semiconductor processing equipment and impedance-matching method29 Sep 2026US 12,749,654 B2Beijing Naura Microelectronics Equipment Co., Ltd.
- Signal processing system and power supply device having a signal processing system15 Sep 2026US 12,738,466 B2TRUMPF Huettinger GmbH + Co. KG
- Method for plasma processing8 Sep 2026US 12,731,762 B2Tokyo Electron Limited
- Substrate processing method and plasma processing apparatus8 Sep 2026US 12,731,764 B2Tokyo Electron Limited
- Systems and methods for etching a high aspect ratio structure1 Oct 2026US 2026/0305206 A1Lam Research Corporation
- Plasma potential adjustment circuit24 Sep 2026US 2026/0290752 A1Tokyo Electron Limited
- Methods for inhibiting precursor interactions during radical-enhanced atomic layer deposition17 Sep 2026US 2026/0275519 A1Lotus Applied Technology, LLC
- Antenna for inductively coupled plasma excitation, antenna unit for inductively coupled plasma excitation, and plasma processing apparatus17 Sep 2026US 2026/0279726 A1Tokyo Electron Limited
- Plasma processing system configured to deliver a pulsed voltage waveform30 Jul 2026US 2026/0221389 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011
- Oxide and metal removal562US 9,309,598 B2APPLIED Materials.Inc. · 2016
- Rate enhanced pulsed DC sputtering system79US 9,812,305 B2Advanced Energy Industries, Inc. · 2017
- Heating plate with planar heating zones for semiconductor processing74US 8,637,794 B2Lam Research Corporation · 2014
- Electronically variable capacitor and RF matching network incorporating same61US 9,496,122 B1Reno Technologies, Inc. · 2016