H01J 2237/0206
Extinguishing, preventing or controlling unwanted discharges
H01J2237/0206 (Extinguishing, preventing or controlling unwanted discharges) appears on 250 US grants and 243 published applications in this corpus.
Search patents in H01J- Granted patents
- 250
- Published applications
- 243
- Assignees
- 149
- Inventors
- 619
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 11 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 1 |
| 2002 | 5 | 7 |
| 2003 | 6 | 8 |
| 2004 | 4 | 17 |
| 2005 | 11 | 13 |
| 2006 | 4 | 13 |
| 2007 | 11 | 10 |
| 2008 | 3 | 26 |
| 2009 | 11 | 13 |
| 2010 | 13 | 14 |
| 2011 | 21 | 11 |
| 2012 | 9 | 4 |
| 2013 | 5 | 7 |
| 2014 | 9 | 10 |
| 2015 | 7 | 6 |
| 2016 | 6 | 4 |
| 2017 | 7 | 12 |
| 2018 | 8 | 5 |
| 2019 | 5 | 6 |
| 2020 | 7 | 9 |
| 2021 | 8 | 5 |
| 2022 | 5 | 8 |
| 2023 | 2 | 10 |
| 2024 | 6 | 9 |
| 2025 | 7 | 7 |
| 2026 | 3 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Apparatus for analyzing and/or processing a sample with a particle beam and method24 Mar 2026US 12,586,755 B2Carl Zeiss SMT GmbH
- Plasma processing apparatus and storage medium13 Jan 2026US 12,525,438 B2Tokyo Electron Limited
- Spray-coated electrostatic chuck design18 Nov 2025US 12,476,086 B2APPLIED Materials.Inc.
- Charged particle beam device19 Aug 2025US 12,394,586 B2Hitachi High-Tech Corporation
- Wafer placement table8 Oct 2026US 2026/0311975 A1NGK Corporation
- Shield arrangement for electron-optical module24 Sep 2026US 2026/0290742 A1ASML Netherlands B. V.
- Charged Particle Beam Device3 Sep 2026US 2026/0260845 A1Hitachi High-Tech Corporation
- Charged particle apparatus, method of projecting charged particles, method of assessing a sample23 Jul 2026US 2026/0213115 A1ASML Netherlands B. V.
- Substrate support unit and substrate processing apparatus2 Jul 2026US 2026/0190940 A1Semes Co., Ltd.
Most cited
By later US patents
- Reactor useful for chemical vapor deposition of titanium nitride526US 6,106,625 AAPPLIED Materials.Inc. · 2000
- Method and apparatus for protection of conductive surfaces in a plasma processing reactor319US 5,366,585 AAPPLIED Materials.Inc. · 1994
- Spark eliminating sputtering target and method for using and making same238US 5,922,176 ADonnelly Corporation · 1999
- Enhanced reactive DC sputtering system162US 5,718,813 AAdvanced Energy Industries, Inc. · 1998
- Method and apparatus for clearing short-circuited, high-voltage cathodes in a sputtering chamber149US 4,610,775 AWestinghouse Electric Corp. · 1986