H01J 2237/002
Cooling arrangements
H01J2237/002 (Cooling arrangements) appears on 496 US grants and 751 published applications in this corpus.
Search patents in H01J- Granted patents
- 496
- Published applications
- 751
- Assignees
- 201
- Inventors
- 1,619
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 2 | 3 |
| 2008 | 4 | 4 |
| 2009 | 2 | 8 |
| 2010 | 4 | 6 |
| 2011 | 6 | 7 |
| 2012 | 3 | 10 |
| 2013 | 9 | 12 |
| 2014 | 10 | 16 |
| 2015 | 19 | 31 |
| 2016 | 18 | 23 |
| 2017 | 23 | 32 |
| 2018 | 21 | 31 |
| 2019 | 25 | 77 |
| 2020 | 44 | 74 |
| 2021 | 46 | 53 |
| 2022 | 54 | 47 |
| 2023 | 44 | 87 |
| 2024 | 32 | 77 |
| 2025 | 64 | 92 |
| 2026 | 47 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High power generator and method of supplying high power pulses6 Oct 2026US 12,755,932 B2Trumpf Huettinger Sp. Z O. O.
- High power generator and method of supplying high power pulses6 Oct 2026US 12,755,933 B2Trumpf Huettinger Sp. Z O. O.
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Magnetron sputtering apparatus29 Sep 2026US 12,747,493 B2Daegu Gyeongbuk Institute of Science and Technology
- Systems and Methods for Uncertainty-Aware-Single-Particle Cryo-EM Data Collection Using Online Feedback8 Oct 2026US 2026/0311330 A1The Regents of the University of Michigan
- Cascade arc plasma generator1 Oct 2026US 2026/0302133 A1Hefei Institute of Physical Science, Chinese Academy of Sciences
- Shower head and plasma processing apparatus including the same and method of manufacturing a semiconductor device1 Oct 2026US 2026/0302138 A1Samsung Electronics Co., Ltd.
- Plasma processing apparatus1 Oct 2026US 2026/0302148 A1Ulvac, Inc.
- Porous plug assembly, electrostatic chuck, and plasma etching apparatus1 Oct 2026US 2026/0305249 A1Advanced Micro-Fabrication Equipment Inc. China
Most cited
By later US patents
- Chemical control features in wafer process equipment198US 9,132,436 B2APPLIED Materials.Inc. · 2015
- Method for conducting heat to or from an article being treated under vacuum120US 4,261,762 AEaton Corporation · 1981
- Chemical control features in wafer process equipment106US 9,978,564 B2APPLIED Materials.Inc. · 2018
- Plasma processing method and plasma processing apparatus50US 10,553,407 B2Tokyo Electron Limited · 2020
- Closed cycle gas cryogenically cooled radiation detector49US 5,552,608 APhilips Electronics North America Corporation · 1996