H01G 4/33
Thin- or thick-film capacitors
Official title: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)}
H01G4/33 (Thin- or thick-film capacitors) appears on 1,462 US grants and 2,044 published applications in this corpus.
Search patents in H01G- Granted patents
- 1,462
- Published applications
- 2,044
- Assignees
- 493
- Inventors
- 3,235
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 8 | 8 |
| 2002 | 5 | 19 |
| 2003 | 17 | 33 |
| 2004 | 28 | 41 |
| 2005 | 31 | 41 |
| 2006 | 35 | 53 |
| 2007 | 31 | 84 |
| 2008 | 40 | 103 |
| 2009 | 41 | 74 |
| 2010 | 62 | 96 |
| 2011 | 58 | 52 |
| 2012 | 55 | 53 |
| 2013 | 67 | 60 |
| 2014 | 52 | 50 |
| 2015 | 46 | 65 |
| 2016 | 48 | 60 |
| 2017 | 58 | 88 |
| 2018 | 62 | 118 |
| 2019 | 100 | 125 |
| 2020 | 88 | 112 |
| 2021 | 91 | 104 |
| 2022 | 95 | 125 |
| 2023 | 83 | 139 |
| 2024 | 89 | 137 |
| 2025 | 102 | 118 |
| 2026 | 55 | 86 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Film capacitor having a terminal electrode including a substrate connector, and method for producing film capacitor22 Sep 2026US 12,744,161 B2Murata Manufacturing Co., Ltd.
- Support substrate for passive electronic component, passive electronic component, semiconductor device, matching circuit, and filter circuit22 Sep 2026US 12,745,457 B2Murata Manufacturing Co., Ltd.
- Multilayer capacitor with a dielectric including an aluminum nitride based compound8 Sep 2026US 12,731,731 B2Samsung Electro-Mechanics Co., Ltd.
- Capacitor, electric circuit, circuit board, apparatus, and power storage device1 Sep 2026US 12,725,735 B2Panasonic Intellectual Property Management Co., Ltd.
- Capacitor, electronic device including the same, and method of manufacturing the same25 Aug 2026US 12,718,983 B2Samsung Electronics Co., Ltd.
- Semiconductor device with advanced pad structure and method for forming same1 Oct 2026US 2026/0302085 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Structure comprising two layers of different electrical nature and its preparation method24 Sep 2026US 2026/0290707 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Coaxial capacitor topology for reduced equivalent series resistance and equivalent series inductance24 Sep 2026US 2026/0290708 A1
- Semiconductor device24 Sep 2026US 2026/0290709 A1Murata Manufacturing Co., Ltd.
- Stacked integrated passive device17 Sep 2026US 2026/0279687 A1MACOM Technology Solutions Holdings, Inc.
Most cited
By later US patents
- Method for manufacturing a polycrystalline dielectric layer521US 8,667,654 B2STMicroelectronics (Crolles 2) SAS · 2014
- Method of manufacturing capacitive insulating film for capacitor449US 8,198,168 B2Elpida Memory, Inc. · 2012
- Nanostructured fillers and carriers316US 6,228,904 B1Nanomaterials Research Corporation · 2001
- Materials and products using nanostructured non-stoichiometric substances226US 6,344,271 B12002
- Nanotechnology for biomedical products224US 6,572,672 B2NanoProducts Corporation · 2003