Semiconductor device

Abstract

A semiconductor device includes a semiconductor base that has a lower surface, an upper surface spaced from the lower surface in a height direction, and a side surface connecting the upper and lower surfaces, and a capacitive portion that is disposed in a direction of the side surface of the semiconductor base, the lower surface is to face a mounting surface on which the semiconductor device is to be mounted, the capacitive portion has a multilayer structure including at least a first dielectric layer that is disposed along the side surface and first and second conductive layers that face each other with the first dielectric layer interposed therebetween, the semiconductor base includes at least one trench portion that has an opening in the side surface, and at least a part of the capacitive portion is inside the at least one trench portion.

Dependencies are inferred from the claim text.