G11C 2229/72
Location of redundancy information
G11C2229/72 (Location of redundancy information) appears on 54 US grants and 56 published applications in this corpus.
Search patents in G11C- Granted patents
- 54
- Published applications
- 56
- Assignees
- 34
- Inventors
- 118
- Latest grant
- 30 Aug 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 3 | 4 |
| 2007 | 3 | 7 |
| 2008 | 4 | 12 |
| 2009 | 8 | 8 |
| 2010 | 7 | 2 |
| 2011 | 6 | 6 |
| 2012 | 1 | 1 |
| 2013 | 5 | 2 |
| 2014 | 4 | 3 |
| 2015 | 2 | 3 |
| 2016 | 1 | 1 |
| 2017 | 3 | 0 |
| 2018 | 0 | 3 |
| 2019 | 3 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Modifiable repair solutions for a memory array30 Aug 2022US 11,430,539 B2Micron Technology, Inc.
- Run-time memory device failure detection enhancement20 Apr 2021US 10,984,882 B2Western Digital Technologies, Inc.
- DRAM device with embedded flash memory for redundancy and fabrication method thereof7 Jan 2020US 10,529,423 B2Fujian Jinhua Integrated Circuit Co., Ltd.
- Run-time flash die failure detection enhancement22 Oct 2019US 10,453,548 B2Western Digital Technologies, Inc.
- Methods and apparatus for providing redundancy in memory15 Oct 2019US 10,446,258 B2Micron Technology, Inc.
- Modifiable repair solutions for a memory array30 Dec 2021US 2021/0407615 A1Micron Technology, Inc.
- Run-Time Memory Device Failure Detection Enhancement23 Jan 2020US 2020/0027520 A1Western Digital Technologies, Inc.
- Dram device with embedded flash memory for redundancy and fabrication method thereof26 Sep 2019US 2019/0295645 A1Fujian Jinhua Integrated Circuit Co., Ltd.
- Run-time flash die failure detection enhancement22 Nov 2018US 2018/0336960 A1Western Digital Technologies, Inc.
- Dram device with embedded flash memory for redundancy and fabrication method thereof4 Oct 2018US 2018/0286481 A1Fujian Jinhua Integrated Circuit Co., Ltd.
Most cited
By later US patents
- Method and apparatus for storing and distributing memory repair information52US 7,757,135 B2Mentor Graphics Corporation · 2010
- Semiconductor memory device33US 7,110,294 B2Kabushiki Kaisha Toshiba · 2006
- Memory circuit17US 8,015,438 B2Qimonda AG · 2011
- Self-diagnostic scheme for detecting errors14US 7,694,196 B2Qimonda North America Corp. · 2010
- Integrated circuit having memory repair information storage and method therefor13US 8,634,263 B2Freescale Semiconductor, Inc. · 2014