G01R 31/2881
Related to environmental aspects other than temperature
Official title: {related to environmental aspects other than temperature, e.g. humidity or vibrations}
G01R31/2881 (Related to environmental aspects other than temperature) appears on 129 US grants and 144 published applications in this corpus.
Search patents in G01R- Granted patents
- 129
- Published applications
- 144
- Assignees
- 112
- Inventors
- 414
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 5 |
| 2006 | 5 | 2 |
| 2007 | 1 | 12 |
| 2008 | 4 | 3 |
| 2009 | 7 | 5 |
| 2010 | 5 | 4 |
| 2011 | 1 | 4 |
| 2012 | 3 | 5 |
| 2013 | 7 | 7 |
| 2014 | 2 | 4 |
| 2015 | 5 | 6 |
| 2016 | 3 | 4 |
| 2017 | 2 | 2 |
| 2018 | 2 | 8 |
| 2019 | 7 | 6 |
| 2020 | 7 | 9 |
| 2021 | 11 | 12 |
| 2022 | 13 | 13 |
| 2023 | 9 | 6 |
| 2024 | 8 | 8 |
| 2025 | 5 | 7 |
| 2026 | 7 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Test environment control system22 Sep 2026US 12,742,816 B2Yishi Industrial Co., Ltd
- Test apparatus for semiconductor device and method of manufacturing semiconductor device5 May 2026US 12,618,897 B2Mitsubishi Electric Corporation
- Fluidic wafer probe28 Apr 2026US 12,613,259 B2Texas Instruments Incorporated
- Semiconductor testing apparatus and method of manufacturing semiconductor device31 Mar 2026US 12,590,999 B2Mitsubishi Electric Corporation
- Electronics tester24 Mar 2026US 12,584,958 B2Aehr Test Systems
- Method and system for testing the resilience of an electronic device that in use is subjected to periodic deformations17 Sep 2026US 2026/0276699 A1
- Electronics tester27 Aug 2026US 2026/0251698 A1Aehr Test Systems
- Electronics tester27 Aug 2026US 2026/0251699 A1Aehr Test Systems
- Electronics tester27 Aug 2026US 2026/0251700 A1Aehr Test Systems
- Electronics tester27 Aug 2026US 2026/0251701 A1Aehr Test Systems
Most cited
By later US patents
- Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer173US 5,701,666 AMotorola, Inc. · 1997
- Discrete placement of radiation sources on integrated circuit devices60US 7,649,257 B2International Business Machines Corporation · 2010
- Method for testing a product integrated circuit wafer using a stimulus integrated circuit wafer31US 6,411,116 B1Motorola, Inc. · 2002
- Method for qualifying biased integrated circuits on a wafer level28US 4,288,911 AHarris Corporation · 1981
- Enhanced defect elimination process for electronic assemblies via application of sequentially combined multiple stress processes21US 5,744,975 AInternational Business Machines Corporation · 1998