G01B 11/0633
Using one or more discrete wavelengths
Official title: {using one or more discrete wavelengths}
G01B11/0633 (Using one or more discrete wavelengths) appears on 163 US grants and 183 published applications in this corpus.
Search patents in G01B- Granted patents
- 163
- Published applications
- 183
- Assignees
- 136
- Inventors
- 450
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 1 |
| 2003 | 1 | 3 |
| 2004 | 2 | 2 |
| 2005 | 2 | 1 |
| 2006 | 1 | 2 |
| 2007 | 2 | 0 |
| 2008 | 1 | 3 |
| 2009 | 2 | 3 |
| 2010 | 3 | 2 |
| 2011 | 2 | 5 |
| 2012 | 2 | 7 |
| 2013 | 3 | 10 |
| 2014 | 7 | 9 |
| 2015 | 4 | 11 |
| 2016 | 9 | 10 |
| 2017 | 7 | 7 |
| 2018 | 10 | 14 |
| 2019 | 8 | 16 |
| 2020 | 12 | 14 |
| 2021 | 13 | 20 |
| 2022 | 8 | 13 |
| 2023 | 14 | 12 |
| 2024 | 6 | 6 |
| 2025 | 10 | 4 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Continuous bump measurement height metrology19 May 2026US 12,631,440 B2Camtek Ltd.
- Dual laser measurement device and online ordering system using the same24 Mar 2026US 12,584,729 B2
- Film thickness measuring device and film thickness measuring method17 Mar 2026US 12,578,183 B2Hamamatsu Photonics K.K.
- Functional layer inspection method and functional layer inspection device10 Sep 2026US 2026/0266712 A1Samsung Display Co., Ltd.
- Method for the contactless and non-destructive measurement of a coated surface and device therefor10 Sep 2026US 2026/0266717 A1coatmaster AG
- Film thickness measuring device and film thickness measuring method26 Mar 2026US 2026/0085925 A1Hamamatsu Photonics K.K.
- Virtual metrology apparatus, virtual metrology method, and virtual metrology program26 Feb 2026US 2026/0056009 A1Tokyo Electron Limited
- Method and system for measuring bump height differences12 Feb 2026US 2026/0043647 A1Camtek Ltd.
Most cited
By later US patents
- Optical system and method for angle-dependent reflection or transmission measurement255US 5,889,593 AKLA Instruments Corporation · 1999
- Surface scanner with thin film gauge121US 5,416,594 ATencor Instruments · 1995
- Thin film thickness measuring method112US 4,899,055 ATencor Instruments · 1990
- Thin film thickness measurements and depth profiling utilizing a thermal wave detection system80US 4,513,384 ATherma-Wave, Inc. · 1985
- Method and arrangement for determining the layer-thickness and the substrate temperature during coating62US 5,564,830 AFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. · 1996