Continuous bump measurement height metrology
AssigneeCamtek Ltd.
InventorEyal Segev
Life of this patent
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AssigneeCamtek Ltd.
InventorEyal Segev
Estimating the term…
A method that may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors resulting from a virtual penetration of the first illumination into the layer; wherein each bump has a corresponding area that is proximate to the bump; preforming second measurements of thickness of the layer at the corresponding areas; wherein at least some of the first measurements are executed in parallel to an executing of at least some of the second measurements; determining first measurement errors, based on the second measurements; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.
A method for measuring height differences between tops of multiple bumps and corresponding areas of an upper surface of a layer, the method comprises:
A measurement system for measuring height differences between tops of multiple bumps and corresponding areas of an upper surface of a layer, the system comprises:
A non-transitory computer readable medium for measuring height differences between tops of multiple bumps and corresponding areas of an upper surface of a layer, the non-transitory computer readable medium stores instructions for:
Dependencies are inferred from the claim text.