F27D 3/0084
Charging
Official title: {Charging; Manipulation of SC or SC wafers}
F27D3/0084 (Charging) appears on 66 US grants and 86 published applications in this corpus.
Search patents in F27D- Granted patents
- 66
- Published applications
- 86
- Assignees
- 41
- Inventors
- 190
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 4 |
| 2007 | 2 | 5 |
| 2008 | 2 | 2 |
| 2009 | 2 | 0 |
| 2010 | 3 | 4 |
| 2011 | 3 | 0 |
| 2012 | 2 | 4 |
| 2013 | 0 | 1 |
| 2014 | 2 | 4 |
| 2015 | 3 | 2 |
| 2016 | 1 | 7 |
| 2017 | 2 | 0 |
| 2018 | 2 | 2 |
| 2019 | 3 | 2 |
| 2020 | 4 | 9 |
| 2021 | 3 | 12 |
| 2022 | 7 | 4 |
| 2023 | 6 | 6 |
| 2024 | 9 | 4 |
| 2025 | 5 | 4 |
| 2026 | 1 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heat treatment apparatus and heat treatment method24 Feb 2026US 12,560,383 B2Tokyo Electron Limited
- Heater lift assembly spring damper30 Dec 2025US 12,512,338 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Injector configured for arrangement within a reactor of a vertical furnace and vertical furnace9 Sep 2025US 12,410,518 B2ASM IP Holding B. V.
- Substrate processing apparatus12 Aug 2025US 12,387,949 B2Kokusai Electric Corporation
- Dynamic and localized temperature control for epitaxial deposition reactors24 Jun 2025US 12,341,038 B2APPLIED Materials.Inc.
- Vertical heat treatment device10 Sep 2026US 2026/0271654 A1Changzhou S.C Exact Equipment Co., Ltd.
- Substrate processing apparatus and gas pressure control method used therein25 Jun 2026US 2026/0182292 A1HPSP Co., Ltd.
- Heat treatment device30 Apr 2026US 2026/0118063 A1ACM Research Korea CO., LTD.
- Heat treatment furnace with stable conveyance26 Mar 2026US 2026/0085888 A1Suzhou Nsingle Intelligent Technology Co., Ltd.
- Heater lift assembly spring damper19 Mar 2026US 2026/0082847 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Susceptor heater shim529US 9,202,727 B2ASM IP Holding B. V. · 2015
- Apparatus and method for calculating a wafer position in a processing chamber under process conditions510US 9,117,866 B2ASM IP Holding B. V. · 2015
- Substrate heat treatment apparatus491US 7,432,476 B2Dainippon Screen Mfg.Co., Ltd. · 2008
- Thermal processing apparatus, thermal processing method, and substrate processing apparatus16US 7,522,823 B2Sokudo Co., Ltd. · 2009
- Heat treatment system and a method for cooling a loading chamber13US 7,059,849 B2Tokyo Electron Limited · 2006