C25D 5/617
Crystalline layers
Official title: {Crystalline layers}
C25D5/617 (Crystalline layers) appears on 506 US grants and 658 published applications in this corpus.
Search patents in C25D- Granted patents
- 506
- Published applications
- 658
- Assignees
- 361
- Inventors
- 1,491
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 5 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 4 |
| 2002 | 9 | 12 |
| 2003 | 9 | 19 |
| 2004 | 15 | 22 |
| 2005 | 15 | 26 |
| 2006 | 6 | 25 |
| 2007 | 11 | 17 |
| 2008 | 13 | 17 |
| 2009 | 12 | 34 |
| 2010 | 13 | 29 |
| 2011 | 13 | 24 |
| 2012 | 10 | 37 |
| 2013 | 10 | 30 |
| 2014 | 28 | 29 |
| 2015 | 24 | 33 |
| 2016 | 24 | 35 |
| 2017 | 23 | 41 |
| 2018 | 24 | 39 |
| 2019 | 32 | 31 |
| 2020 | 25 | 31 |
| 2021 | 20 | 27 |
| 2022 | 28 | 26 |
| 2023 | 21 | 26 |
| 2024 | 23 | 22 |
| 2025 | 14 | 9 |
| 2026 | 10 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electric contact having a multilayered coating structure14 Jul 2026US 12,683,312 B2TE Connectivity Germany GmbH
- Copper alloy film with high strength and high conductivity16 Jun 2026US 12,655,500 B2Apple Inc.
- Microcalorimeter radiation detector absorbers and methods of making the same26 May 2026US 12,638,345 B1Los Alamos National Security, LLC
- Electro-formed metal foils19 May 2026US 12,635,422 B2American Superconductor Corporation
- Metal component12 May 2026US 12,628,664 B2Mitsui High-Tec, Inc.
- Electro-formed metal foils10 Sep 2026US 2026/0271625 A1American Superconductor Corporation
- Nickel-plated metal material6 Aug 2026US 2026/0226644 A1Toyo Kohan Co.Ltd
- Electrodeposition using ultrashort duration pulses6 Aug 2026US 2026/0226646 A1Nanovis, LLC
- Electric wire6 Aug 2026US 2026/0229382 A1Sumitomo Electric Industries, Ltd.
- Composite material, composite material manufacturing method, terminal, and terminal manufacturing method30 Jul 2026US 2026/0218406 A1Dowa Metaltech Co., Ltd.
Most cited
By later US patents
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- Pulse electroplating copper or copper alloys222US 5,972,192 AAdvanced Micro Devices, Inc. · 1999
- Methods for fabricating metal nanowires181US 6,843,902 B1The Regents of the University of California · 2005
- Method and apparatus for plating and polishing a semiconductor substrate132US 6,328,872 B1Nutool, Inc. · 2001
- Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive111US 6,150,186 AFormFactor, Inc. · 2000