Electro-formed metal foils
AssigneeAmerican Superconductor Corporation
InventorCornelis Leo Hans Thieme
Life of this patent
Estimating the term…
Abstract
A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface.
Claims8
A foil comprising an alloy of Ni(1-X-Y)BXCY, the foil having an epitaxial, non-magnetic layer of the alloy having a cube texture overlying a non-epitaxial, non-textured, non-magnetic layer of the alloy, wherein B and C are selected from the group consisting of W, Mo, and Cr;
- and wherein X is 0.02-0.14 and Y is 0-0.14.
A foil comprising an alloy of Ni(1-X-Y)BXCY, the foil having an epitaxial, non-magnetic layer of the alloy having a cube texture overlying a non-epitaxial, non-textured, non-magnetic layer of the alloy, wherein:
- B and C are selected from the group consisting of W, Mo, and Cr;
- and wherein X is 0.02-0.14 and Y is 0-0.14;
- and
- the non-epitaxial layer has an average grain size of between 1 μm to 5 μm.
Dependencies are inferred from the claim text.