C23F 1/40
For etching other metallic material
Official title: for etching other metallic material
C23F1/40 (For etching other metallic material) appears on 84 US grants and 118 published applications in this corpus.
Search patents in C23F- Granted patents
- 84
- Published applications
- 118
- Assignees
- 73
- Inventors
- 235
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 3 |
| 2003 | 1 | 2 |
| 2004 | 3 | 2 |
| 2005 | 0 | 0 |
| 2006 | 2 | 3 |
| 2007 | 1 | 3 |
| 2008 | 0 | 3 |
| 2009 | 0 | 3 |
| 2010 | 1 | 0 |
| 2011 | 1 | 1 |
| 2012 | 3 | 4 |
| 2013 | 0 | 1 |
| 2014 | 1 | 3 |
| 2015 | 3 | 8 |
| 2016 | 3 | 11 |
| 2017 | 4 | 6 |
| 2018 | 6 | 5 |
| 2019 | 6 | 5 |
| 2020 | 4 | 8 |
| 2021 | 5 | 4 |
| 2022 | 5 | 15 |
| 2023 | 7 | 11 |
| 2024 | 10 | 5 |
| 2025 | 9 | 7 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for treating transition metal semiconductor, and reducing agent-containing treatment liquid for transition metal oxide12 May 2026US 12,628,593 B2Tokuyama Corporation
- Etching solution and etching method for gold or gold alloy14 Apr 2026US 12,600,908 B2Kanto Kagaku Kabushiki Kaisha
- Treatment liquid for semiconductor with ruthenium27 Jan 2026US 12,538,727 B2Tokuyama Corporation
- Transparent conductive circuit30 Sep 2025US 12,432,853 B2Chasm Advanced Materials, Inc.
- Etchant composition for titanium-containing metal layer and etching method using the same12 Aug 2025US 12,385,142 B2Enf Technology Co., Ltd.
- Method for treating transition metal semiconductor, and reducing agent-containing treatment liquid for transition metal oxide23 Jul 2026US 2026/0215188 A1Tokuyama Corporation
- Composition, method of treating metal-containing layer, and method of manufacturing semiconductor device4 Jun 2026US 2026/0152687 A1Samsung Electronics Co., Ltd.
- Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same9 Apr 2026US 2026/0098346 A1Samsung Electronics Co., Ltd.
- Transparent Conductive Circuit26 Feb 2026US 2026/0059660 A1Chasm Advanced Materials, Inc.
- Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same1 Jan 2026US 2026/0005029 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Optical diffraction biosensor106US 6,436,651 B1Kimberly-Clark Worldwide, Inc. · 2002
- Optical diffraction biosensor101US 6,060,256 AKimberly-Clark Worldwide, Inc. · 2000
- Nickel strip formulation10US 4,720,332 A1988
- Removal of metallic coatings from polymeric substrates10US 5,127,958 AMorris Resources, Inc. · 1992
- Method of stripping silver from a printed circuit board8US 6,783,690 B22004