C23C 18/2073
Multistep pretreatment
Official title: {Multistep pretreatment}
C23C18/2073 (Multistep pretreatment) appears on 473 US grants and 616 published applications in this corpus.
Search patents in C23C- Granted patents
- 473
- Published applications
- 616
- Assignees
- 363
- Inventors
- 1,474
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 7 | 0 |
| 1982 | 6 | 0 |
| 1983 | 6 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 7 | 0 |
| 1987 | 7 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 9 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 9 | 0 |
| 1998 | 7 | 0 |
| 1999 | 10 | 0 |
| 2000 | 7 | 0 |
| 2001 | 2 | 2 |
| 2002 | 5 | 1 |
| 2003 | 2 | 12 |
| 2004 | 4 | 17 |
| 2005 | 4 | 32 |
| 2006 | 5 | 30 |
| 2007 | 9 | 25 |
| 2008 | 9 | 16 |
| 2009 | 8 | 30 |
| 2010 | 12 | 38 |
| 2011 | 14 | 22 |
| 2012 | 16 | 13 |
| 2013 | 12 | 19 |
| 2014 | 10 | 25 |
| 2015 | 20 | 45 |
| 2016 | 19 | 39 |
| 2017 | 23 | 39 |
| 2018 | 19 | 28 |
| 2019 | 23 | 42 |
| 2020 | 17 | 34 |
| 2021 | 22 | 24 |
| 2022 | 12 | 23 |
| 2023 | 13 | 19 |
| 2024 | 12 | 20 |
| 2025 | 14 | 12 |
| 2026 | 5 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Resin material treatment method, and compositions for the same24 Mar 2026US 12,584,225 B1Okuno Chemical Industries Co., Ltd.
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Method for improving adhesion between metallization layers and ozone-etched plastics3 Feb 2026US 12,540,404 B2MacDermid Enthone Inc.
- Pretreatment method for electroless plating, and pretreatment solution for electroless plating20 Jan 2026US 12,529,145 B2C. Uyemura & Co., Ltd.
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- A method for the pre-treatment of a surface of a substrate6 Aug 2026US 2026/0226628 A1Atotech Deutschland GmbH
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Resin material treatment method, and compositions for the same25 Jun 2026US 2026/0176767 A1Okuno Chemical Industries Co., Ltd.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996
- Deposition of catalytic electrodes on ion-exchange membranes254US 4,364,803 AOronzio de Nora Impianti Elettrochimici S.p.A. · 1982
- Method for the production of radiant energy imaged printed circuit boards103US 3,930,963 APhotocircuits Division of Kollmorgen Corporation · 1976
- Adhesive for electroless plating, printed circuit boards and method of producing the same101US 5,055,321 AIbiden Co., Ltd. · 1991