C23C 18/208
With use of metal first
Official title: {with use of metal first}
C23C18/208 (With use of metal first) appears on 146 US grants and 147 published applications in this corpus.
Search patents in C23C- Granted patents
- 146
- Published applications
- 147
- Assignees
- 142
- Inventors
- 483
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 1 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 9 |
| 2005 | 0 | 12 |
| 2006 | 3 | 11 |
| 2007 | 6 | 9 |
| 2008 | 3 | 5 |
| 2009 | 2 | 6 |
| 2010 | 5 | 9 |
| 2011 | 5 | 3 |
| 2012 | 2 | 2 |
| 2013 | 0 | 5 |
| 2014 | 2 | 2 |
| 2015 | 6 | 8 |
| 2016 | 6 | 11 |
| 2017 | 6 | 14 |
| 2018 | 3 | 3 |
| 2019 | 3 | 7 |
| 2020 | 5 | 6 |
| 2021 | 4 | 4 |
| 2022 | 2 | 5 |
| 2023 | 0 | 4 |
| 2024 | 3 | 2 |
| 2025 | 0 | 2 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Metal coating method for plastic outer shape requiring robustness19 Nov 2024US 12,146,222 B2Imtechnology Co., Ltd.
- Mobile device case and coating method thereof5 Nov 2024US 12,136,940 B2Imtechnology Co., Ltd.
- Compound, substrate for pattern formation, photodegradable coupling agent, pattern formation method, and transistor production method9 Apr 2024US 11,953,833 B2Nikon Corporation
- Method of producing electroconductive substrate, electronic device and display device9 Aug 2022US 11,410,855 B2TDK Corporation
- A method for the pre-treatment of a surface of a substrate6 Aug 2026US 2026/0226628 A1Atotech Deutschland GmbH
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Method for providing a conductive surface on a non-conductive polymeric surface19 Mar 2026US 2026/0078495 A1Cirrus Materials Science Ltd
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser17 Jul 2025US 2025/0230549 A1Andong National University Industry-Academic Cooperation Foundation
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Deposition of catalytic electrodes on ion-exchange membranes254US 4,364,803 AOronzio de Nora Impianti Elettrochimici S.p.A. · 1982
- Adhesive for electroless plating, printed circuit boards and method of producing the same101US 5,055,321 AIbiden Co., Ltd. · 1991
- Selective electroless plating process for metal conductors94US 5,167,992 AMicroelectronics and Computer Technology Corporation · 1992
- Method for conditioning halogenated polymeric materials and structures fabricated therewith61US 5,374,454 AInternational Business Machines Corporation · 1994