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US 12,584,225 B1Granted
Resin material treatment method, and compositions for the same
AssigneeOkuno Chemical Industries Co., Ltd.
InventorsShingo Nagamine, Koji Kita
Life of this patent
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Abstract
The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.
Claims11
A electroless plating method for pretreating a resin material, the method comprising
- (1) step 1:
- bringing the surface to be treated of the resin material into contact with a pretreatment composition, and
- (2) step 2:
- bringing the surface to be treated of the resin material into contact with an electroless plating solution, wherein the pretreatment composition contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions, and
- the pretreatment composition has a pH of 2 or less,
- the method not comprising a catalyst-adding step.
3 more elements
Dependencies are inferred from the claim text.