Pretreatment method for electroless plating, and pretreatment solution for electroless plating
AssigneeC. Uyemura & Co., Ltd.
InventorsTetsuji Ishida, Hisamitsu Yamamoto, Ryoyu Shimizu
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AssigneeC. Uyemura & Co., Ltd.
InventorsTetsuji Ishida, Hisamitsu Yamamoto, Ryoyu Shimizu
Estimating the term…
The purpose of the present invention is to provide a pretreatment method for electroless plating and a pretreatment solution for electroless plating capable of increasing an adsorption amount of a catalyst. A pretreatment method for electroless plating for performing an electroless plating on a substrate, the pretreatment method at least comprises: a cleaner process S10; a soft etching process S20 and/or an acid treatment process S30; a catalyst imparting process S40; and a catalyst reducing process S50, wherein an anionic surfactant for ionizing a part of a hydrophilic group to an anion is added to a treatment solution used in the soft etching process S20 and/or the acid treatment process S30, an ionic catalyst is imparted on the substrate in the catalyst imparting process S40, and the ionic catalyst is reduced in the catalyst reducing process S50 to increase an adsorption amount of the catalyst on the substrate.
A pretreatment method for electroless plating for performing an electroless plating on a substrate, the pretreatment method at least comprises a cleaner process;
Dependencies are inferred from the claim text.