C23C 18/2086
With use of organic or inorganic compounds other than metals, first
Official title: {with use of organic or inorganic compounds other than metals, first}
C23C18/2086 (With use of organic or inorganic compounds other than metals, first) appears on 353 US grants and 492 published applications in this corpus.
Search patents in C23C- Granted patents
- 353
- Published applications
- 492
- Assignees
- 293
- Inventors
- 1,140
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 7 | 0 |
| 2001 | 1 | 1 |
| 2002 | 5 | 0 |
| 2003 | 1 | 11 |
| 2004 | 3 | 10 |
| 2005 | 4 | 21 |
| 2006 | 2 | 20 |
| 2007 | 4 | 17 |
| 2008 | 6 | 12 |
| 2009 | 6 | 24 |
| 2010 | 9 | 30 |
| 2011 | 10 | 16 |
| 2012 | 14 | 9 |
| 2013 | 12 | 17 |
| 2014 | 8 | 23 |
| 2015 | 15 | 39 |
| 2016 | 17 | 30 |
| 2017 | 20 | 35 |
| 2018 | 18 | 26 |
| 2019 | 20 | 34 |
| 2020 | 14 | 29 |
| 2021 | 19 | 19 |
| 2022 | 11 | 18 |
| 2023 | 12 | 17 |
| 2024 | 9 | 18 |
| 2025 | 14 | 10 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Resin material treatment method, and compositions for the same24 Mar 2026US 12,584,225 B1Okuno Chemical Industries Co., Ltd.
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Method for improving adhesion between metallization layers and ozone-etched plastics3 Feb 2026US 12,540,404 B2MacDermid Enthone Inc.
- Pretreatment method for electroless plating, and pretreatment solution for electroless plating20 Jan 2026US 12,529,145 B2C. Uyemura & Co., Ltd.
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Resin material treatment method, and compositions for the same25 Jun 2026US 2026/0176767 A1Okuno Chemical Industries Co., Ltd.
- Liquid-cooling cooler having nickel multilayer structure9 Apr 2026US 2026/0098343 A1Amulaire Thermal Technology, Inc.
- Method for providing a conductive surface on a non-conductive polymeric surface19 Mar 2026US 2026/0078495 A1Cirrus Materials Science Ltd
- Metal Plating of 3D Objects Printed with Catalyst Precursor Resin29 Jan 2026US 2026/0027769 A1Elektrum Technologies, Inc.
Most cited
By later US patents
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996
- Method for the production of radiant energy imaged printed circuit boards103US 3,930,963 APhotocircuits Division of Kollmorgen Corporation · 1976
- Key top for pushbutton switch and method of producing the same90US 6,762,381 B2Polymatech Co., Ltd. · 2004
- Manufacturing computer systems with fine line circuitized substrates71US 6,268,016 B1International Business Machines Corporation · 2001
- Method for fabrication of metallized medical devices67US 5,685,961 AP & D Medical Coatings, Inc. · 1997