C23C 16/45521
The gas, other than thermal contact gas, being introduced the rear of
Official title: {the gas, other than thermal contact gas, being introduced the rear of the substrate to flow around its periphery}
C23C16/45521 (The gas, other than thermal contact gas, being introduced the rear of) appears on 220 US grants and 155 published applications in this corpus.
Search patents in C23C- Granted patents
- 220
- Published applications
- 155
- Assignees
- 72
- Inventors
- 540
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 9 | 0 |
| 1995 | 6 | 0 |
| 1996 | 9 | 0 |
| 1997 | 7 | 0 |
| 1998 | 12 | 0 |
| 1999 | 16 | 0 |
| 2000 | 12 | 0 |
| 2001 | 21 | 4 |
| 2002 | 9 | 5 |
| 2003 | 9 | 10 |
| 2004 | 11 | 9 |
| 2005 | 3 | 8 |
| 2006 | 5 | 7 |
| 2007 | 3 | 6 |
| 2008 | 4 | 7 |
| 2009 | 2 | 6 |
| 2010 | 5 | 3 |
| 2011 | 2 | 8 |
| 2012 | 2 | 0 |
| 2013 | 4 | 3 |
| 2014 | 3 | 1 |
| 2015 | 6 | 10 |
| 2016 | 2 | 4 |
| 2017 | 2 | 2 |
| 2018 | 5 | 4 |
| 2019 | 0 | 6 |
| 2020 | 3 | 6 |
| 2021 | 3 | 8 |
| 2022 | 5 | 17 |
| 2023 | 6 | 10 |
| 2024 | 7 | 4 |
| 2025 | 11 | 6 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structures and methods for processing a semiconductor substrate22 Sep 2026US 12,742,237 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Vented susceptor16 Sep 2025US 12,417,940 B2ASM IP Holding B. V.
- Methods and systems for managing byproduct material accumulation during plasma-based semiconductor wafer fabrication process9 Sep 2025US 12,412,736 B2Lam Research Corporation
- Susceptors with film deposition control features19 Aug 2025US 12,394,659 B2ASM IP Holding B. V.
- Film forming method and semiconductor production apparatus15 Jul 2025US 12,359,308 B2Tokyo Electron Limited
- Substrate backside protection20 Aug 2026US 2026/0242942 A1Picosun Oy
- Vented susceptor4 Dec 2025US 2025/0372439 A1ASM IP Holding B. V.
- Methods and Systems for Managing Byproduct Material Accumulation During Plasma-Based Semiconductor Wafer Fabrication Process27 Nov 2025US 2025/0364233 A1Lam Research Corporation
- Susceptors with film deposition control features30 Oct 2025US 2025/0336712 A1ASM IP Holding B. V.
- Substrate Processing Apparatus, Heat Insulating Structure, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium3 Jul 2025US 2025/0215561 A1Kokusai Electric Corporation
Most cited
By later US patents
- Apparatus and method for growth of a thin film940US 6,511,539 B1ASM America, Inc. · 2003
- Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process777US 5,000,113 AAPPLIED Materials.Inc. · 1991
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Integrated module multi-chamber CVD processing system and its method for processing substrates655US 5,494,494 AAnelva Corporation · 1996
- Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment622US 4,821,674 A1989