C23C 14/0068
Characterised by means for confinement of gases or sputtered material
Official title: {characterised by means for confinement of gases or sputtered material, e.g. screens, baffles}
C23C14/0068 (Characterised by means for confinement of gases or sputtered material) appears on 51 US grants and 60 published applications in this corpus.
Search patents in C23C- Granted patents
- 51
- Published applications
- 60
- Assignees
- 45
- Inventors
- 183
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 1 |
| 2005 | 0 | 4 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 2 |
| 2010 | 2 | 1 |
| 2011 | 1 | 3 |
| 2012 | 0 | 5 |
| 2013 | 2 | 3 |
| 2014 | 2 | 3 |
| 2015 | 3 | 5 |
| 2016 | 2 | 2 |
| 2017 | 1 | 1 |
| 2018 | 1 | 5 |
| 2019 | 3 | 2 |
| 2020 | 2 | 4 |
| 2021 | 1 | 3 |
| 2022 | 1 | 2 |
| 2023 | 3 | 0 |
| 2024 | 2 | 3 |
| 2025 | 4 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate17 Feb 2026US 12,553,124 B2APPLIED Materials.Inc.
- Deposition apparatus2 Dec 2025US 12,488,969 B2SPTS Technologies Limited
- Optimizing cadmium (CD) alloy solar cells with sputtered copper-dopped zinc telluride (ZNTE:CU) back contacts in the presence of hydrogen9 Sep 2025US 12,414,402 B1Conti Innovation Center, LLC
- Optimizing cadmium (Cd) alloy solar cells with sputtered copper-doped zinc telluride (ZnTe:Cu) back contacts in the presence of hydrogen2 Sep 2025US 12,408,469 B1Conti Innovation Center, LLC
- Substrate processing apparatus and method of manufacturing semiconductor device29 Jul 2025US 12,374,527 B2Kokusai Electric Corporation
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate28 May 2026US 2026/0146315 A1APPLIED Materials.Inc.
- Substrate processing apparatus and method of manufacturing semiconductor device30 Oct 2025US 2025/0336646 A1Kokusai Electric Corporation
- Sputtering target, sputtering apparatus including the sputtering target, and method for manufacturing display device using the sputtering target11 Sep 2025US 2025/0285862 A1Samsung Display Co., Ltd.
- Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate12 Sep 2024US 2024/0301546 A1APPLIED Materials.Inc.
- Method for depositing a layer optical element, and optical assembly for the duv wavelength range23 May 2024US 2024/0167145 A1Carl Zeiss SMT GmbH
Most cited
By later US patents
- Stationary aperture plate for reactive sputter deposition566US 5,415,753 AMaterials Research Corporation · 1995
- Sputter deposition shield assembly to reduce cathode shorting69US 8,591,709 B1WD Media, LLC · 2013
- Apparatus for the reactive coating of a substrate68US 5,169,509 ALeybold Aktiengesellschaft · 1992
- Apparatus for coating a substrate with dielectrics61US 4,931,169 ALeybold Aktiengesellschaft · 1990
- Deposition of films onto large area substrates using modified reactive magnetron sputtering48US 4,931,158 AThe Regents of the Univ. of Calif. · 1990