C09J 2481/006
In the substrate
Official title: in the substrate
C09J2481/006 (In the substrate) appears on 30 US grants and 59 published applications in this corpus.
Search patents in C09J- Granted patents
- 30
- Published applications
- 59
- Assignees
- 46
- Inventors
- 150
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 1 |
| 2003 | 2 | 4 |
| 2004 | 4 | 4 |
| 2005 | 1 | 0 |
| 2006 | 1 | 3 |
| 2007 | 0 | 2 |
| 2008 | 2 | 1 |
| 2009 | 1 | 2 |
| 2010 | 1 | 2 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 2 | 4 |
| 2016 | 0 | 3 |
| 2017 | 1 | 3 |
| 2018 | 0 | 4 |
| 2019 | 0 | 3 |
| 2020 | 2 | 2 |
| 2021 | 0 | 4 |
| 2022 | 3 | 5 |
| 2023 | 4 | 0 |
| 2024 | 2 | 4 |
| 2025 | 0 | 3 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Direct application of thermosetting composite surfacing films to UV-treated thermoplastic surfaces and related composite structures31 Mar 2026US 12,589,555 B2Henkel AG & Co. KGaA
- Transparent, heat resistive, adhesive tape with antistatic performance and method of use thereof17 Feb 2026US 12,552,967 B23M Innovative Properties Company
- Polyorganosiloxane composition for use in adhesion of a polyphenylene sulfide resin31 Dec 2024US 12,180,397 B2Momentive Performance Materials Japan LLC
- Addition curable silicone adhesive compositions9 Apr 2024US 11,952,516 B2Momentive Performance Materials Inc.
- Activating surfaces for subsequent bonding17 Oct 2023US 11,787,911 B2Henkel AG & Co. KGaA
- Laminate and method for manufacturing laminate6 Nov 2025US 2025/0340048 A1Mitsui Chemicals, Inc.
- Adhesive film and method for producing adhesive film5 Jun 2025US 2025/0179336 A1Fujimori Kogyo Co., Ltd.
- Compositions for forming antistatic coatings and articles coated with the compositions10 Apr 2025US 2025/0115780 A1W. L. Gore & Associates, Inc.
- Coating material, coating film, layered product, and flexible flat cable11 Jul 2024US 2024/0228814 A9Riken Technos Corporation
- Green alternative polyurethane adhesive27 Jun 2024US 2024/0209247 A1Henkel AG & Co. KGaA
Most cited
By later US patents
- Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same24US 6,673,441 B1Hitachi Chemical Company, Ltd. · 2004
- Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device13US 6,700,185 B1Hitachi Chemical Company, Ltd. · 2004
- Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same8US 6,733,880 B2Hitachi Chemical Company, Ltd. · 2004
- Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same8US 6,838,170 B2Hitachi Chemical Company, Ltd. · 2005
- Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device5US 7,057,266 B2Hitachi Chemical Company, Ltd. · 2006