Loading patent…
AssigneeHitachi Chemical Company, Ltd.
InventorsYuko Tanaka, Yasushi Shimada, Teiichi Inada, Hiroyuki Kuriya, Kazunori Yamamoto, Yasushi Kumashiro, Keiji Sumiya
Estimating the term…
An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.
An adhesive, which is an adhesive composition comprising two kinds of resins which when the composition is in a B-stage state, separate from each other into a disperse phase and a continuous phase, a hardener and a curing accelerator, wherein in the B-stage state, the curing accelerator is compatible with the disperse phase and separates from the continuous phase, the B-stage state being a state wherein, as measured by using differential scanning thermal analysis, 10-40% of heat to be generated by complete curing of the adhesive composition has been generated.
Dependencies are inferred from the claim text.