Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same
AssigneeHitachi Chemical Company, Ltd.
InventorsYoshiyuki Tanabe, Hidekazu Matsuura
Life of this patent
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Abstract
An adhesive film for semiconductor, which has a three-layer structure consisting of a support film having each face coated with an adhesive layer, each adhesive layer containing (A) a heat resistant thermoplastic resin having a glass transition temperature of 130 to 300° C., a water absorption of 3% by weight or less and a squeeze length of 2 mm or less, (B) an epoxy resin and (C) a trisphenol compound as an epoxy resin-curing agent; a lead frame with adhesive film; and a semiconductor device wherein the lead frame with adhesive film is bonded to a semiconductor element.
Claims25
An adhesive film for semiconductor, which has a three-layer structure consisting of a support film having each face coated with an adhesive layer, each adhesive layer containing (A) a heat resistant thermoplastic resin having a glass transition temperature of 130 to 300° C., a water absorption of 3% by weight or less and a squeeze length of 2 mm or less, (B) an epoxy resin and (C) a trisphenol compound as an epoxy resin-curing agent.
An adhesive film for semiconductor, which has a three-layer structure consisting of a support film having each face coated with an adhesive layer, each adhesive layer containing (A) a heat resistant thermoplastic resin having a glass transition temperature of 130 to 300° C., (B) an epoxy resin and (C) a trisphenol compound as an epoxy resin-curing agent, wherein the adhesive film having the three-layer structure has a water absorption of 3% by weight or less and a squeeze length of 2 mm or less.
Dependencies are inferred from the claim text.