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AssigneeHenkel AG & Co. KGaA
InventorsSina Chaeichian, Kaspar Schaerer, Ruairi O′Kane, Li Li, Michael D. Halbasch, Martin Renkel, Omar L. Abu-Shanab, Brian Deegan, Anna Esmeralda Javier
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This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.
A composite structure comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film by cross-polymer linkages formed between an actinic irradiated surface of the thermoplastic substrate and reactive groups of the thermoset(ting) surfacing film, the direct bonding defining an interface between the actinic irradiated surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film in the absence of any material not sourced from the thermoplastic substrate or the thermoset(ting) surfacing film, the thermoset(ting) surfacing film further comprising a second surface opposite the first surface of the thermoset(ting) surfacing film and a peelable material at or beneath the second surface, the peelable material permitting removal to provide a paint-ready surface.
Dependencies are inferred from the claim text.