An adhesive, comprising (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 5 to 40 parts by weight of a high molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or more, (3) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature Tg of −10° C. or higher and a weight average molecular weight of 100,000 or more and (4) 0.1 to 20 parts by weight of a latent curing accellerator, selected from the group consisting of an amine-epoxy adduct latent curing accellerator, an amine-ureido adduct latent curing accellerator and an amine-urethane adduct latent curing accelerator.