C09J 2481/00
Presence of sulfur containing polymers
C09J2481/00 (Presence of sulfur containing polymers) appears on 77 US grants and 129 published applications in this corpus.
Search patents in C09J- Granted patents
- 77
- Published applications
- 129
- Assignees
- 94
- Inventors
- 367
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 1 |
| 2003 | 2 | 5 |
| 2004 | 4 | 4 |
| 2005 | 2 | 3 |
| 2006 | 1 | 4 |
| 2007 | 0 | 2 |
| 2008 | 2 | 1 |
| 2009 | 1 | 2 |
| 2010 | 2 | 4 |
| 2011 | 2 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 1 | 5 |
| 2015 | 4 | 8 |
| 2016 | 4 | 7 |
| 2017 | 2 | 8 |
| 2018 | 2 | 6 |
| 2019 | 1 | 9 |
| 2020 | 5 | 7 |
| 2021 | 3 | 16 |
| 2022 | 5 | 6 |
| 2023 | 10 | 7 |
| 2024 | 9 | 9 |
| 2025 | 4 | 10 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sealant sheet16 Jun 2026US 12,655,335 B2Nitto Denko Corporation
- Direct application of thermosetting composite surfacing films to UV-treated thermoplastic surfaces and related composite structures31 Mar 2026US 12,589,555 B2Henkel AG & Co. KGaA
- Transparent, heat resistive, adhesive tape with antistatic performance and method of use thereof17 Feb 2026US 12,552,967 B23M Innovative Properties Company
- Sealing method18 Nov 2025US 12,473,458 B2Nitto Denko Corporation
- Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same29 Apr 2025US 12,286,564 B2LG Chem.Ltd.
- Laminate and method for manufacturing laminate6 Nov 2025US 2025/0340048 A1Mitsui Chemicals, Inc.
- Resin compositions for optically clear adhesives and methods of enhancing adhesion forces thereof9 Oct 2025US 2025/0313736 A1
- Underwater adhesive25 Sep 2025US 2025/0297149 A1The University of Tokyo
- Method for manufacturing semiconductor device25 Sep 2025US 2025/0299997 A1Resonac Corporation
- Method of underwater bonding26 Jun 2025US 2025/0207001 A1
Most cited
By later US patents
- Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same24US 6,673,441 B1Hitachi Chemical Company, Ltd. · 2004
- Method of joining fluorocarbon membrane sheets with quaternary ammonium compounds16US 4,165,248 APPG Industries, Inc. · 1979
- Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device13US 6,700,185 B1Hitachi Chemical Company, Ltd. · 2004
- Method of surface preparation of aluminum substrates12US 5,520,768 AThiokol Corporation · 1996
- Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same8US 6,733,880 B2Hitachi Chemical Company, Ltd. · 2004