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US 12,286,564 B2Granted
Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same
AssigneeLG Chem, Ltd.
InventorsYoungsam Kim, You Jin Kyung, Kwang Joo Lee, Minsu Jeong, Junghak Kim, Ju Hyeon Kim
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Abstract
The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.
Claims12
A resin composition for semiconductor adhesion comprising:
- a thermoplastic resin;
- a thermosetting resin;
- a curing agent;
- and a curing catalyst,
- wherein the curing catalyst includes at least one compound selected from the compounds represented by Chemical Formulae 1-1 to 1-5:
2 more elements
Dependencies are inferred from the claim text.