B81C 99/0045
End test of the packaged device
Official title: {End test of the packaged device}
B81C99/0045 (End test of the packaged device) appears on 81 US grants and 91 published applications in this corpus.
Search patents in B81C- Granted patents
- 81
- Published applications
- 91
- Assignees
- 54
- Inventors
- 220
- Latest grant
- 13 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 2 |
| 2005 | 3 | 2 |
| 2006 | 3 | 2 |
| 2007 | 0 | 2 |
| 2008 | 1 | 5 |
| 2009 | 4 | 5 |
| 2010 | 1 | 6 |
| 2011 | 3 | 4 |
| 2012 | 9 | 6 |
| 2013 | 6 | 7 |
| 2014 | 4 | 4 |
| 2015 | 3 | 5 |
| 2016 | 7 | 4 |
| 2017 | 1 | 6 |
| 2018 | 8 | 4 |
| 2019 | 7 | 3 |
| 2020 | 2 | 5 |
| 2021 | 2 | 6 |
| 2022 | 7 | 7 |
| 2023 | 3 | 0 |
| 2024 | 3 | 1 |
| 2025 | 2 | 3 |
By publication year.
Recent patents
- Methods and apparatuses for acoustically testing MEMS devices13 May 2025US 12,298,341 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Method for preparing a MEMS micro mirror with electrodes on both sides28 Jan 2025US 12,209,014 B2Anhui China Science MW Electronic Technology Co., Ltd.
- Sensor with integrated heater31 Dec 2024US 12,180,067 B2InvenSense, Inc.
- Semi-finished product of electronic device and electronic device29 Oct 2024US 12,129,169 B2Merry Electronics Co., Ltd.
- Micromechanical sensor unit and method for manufacturing a micromechanical sensor unit27 Feb 2024US 11,912,565 B2Robert Bosch GmbH
- Micro-differential pressure sensor, packaging structure, testing method and electronic device11 Sep 2025US 2025/0282611 A1Memsensing Microsystems (Suzhou, China) Co., Ltd.
- Capacitive sensor and method for operating a capacitive sensor19 Jun 2025US 2025/0199041 A1
- Method for detecting contamination of a mems sensor20 Feb 2025US 2025/0059025 A1
- Micromechanical component and scanning device17 Oct 2024US 2024/0343556 A1
- Method for preparing a mems micro mirror with elctrodes on both sides24 Nov 2022US 2022/0371883 A1Anhui China Science MW Electronic Technology Co., Ltd.
Most cited
By later US patents
- Method of testing of MEMS devices on a wafer level90US 9,034,666 B22015
- Defect detection and repair of micro-electro-mechanical systems (MEMS) devices74US 6,847,907 B1Active Optical Networks, Inc. · 2005
- Sensor system and manufacturing process as well as self-testing process33US 6,294,787 B1Heimann Optoelectronics GmbH · 2001
- Method and system for increasing yield of vertically integrated devices32US 7,056,751 B2Reveo, Inc. · 2006
- MEMS device and fabrication method19US 8,257,985 B2Texas Instruments Incorporated · 2012