Sensor with integrated heater
AssigneeInvenSense, Inc.
InventorsPei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
Life of this patent
Estimating the term…
Abstract
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
Claims13
A device comprising:
- a microelectromechanical system (MEMS) sensor die comprising:
- a substrate;
- a deformable membrane;
- and
- a MEMS heating element integrated within an oxide layer, wherein the deformable membrane is disposed over the oxide layer, and wherein the oxide layer is in direct contact with the substrate,
- wherein the MEMS heating element is configured to generate heat to heat up the deformable membrane.
A device comprising a microelectromechanical system (MEMS) sensor die comprising:
- a substrate;
- an oxide layer disposed over a portion of the substrate, wherein the oxide layer is in direct contact with the portion of the substrate;
- a deformable membrane disposed over the oxide layer that forms a cavity with the substrate;
- and
- a MEMS heating element integrated within the oxide layer that is configured to generate thermal energy to heat up the deformable membrane.
Dependencies are inferred from the claim text.