Method of testing of MEMS devices on a wafer level
OwnerVladimir Vaganov, Nickolai Belovinventors
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OwnerVladimir Vaganov, Nickolai Belovinventors
Estimating the term…
Some embodiments provide methods, process, systems and apparatus for use in testing multi-axis Micro Electro Mechanical Systems (MEMS) devices. In some embodiments, methods of testing are provided, comprising: selecting, according to a test specification and a test program, at least a first MEMS device on a substrate comprising a plurality of MEMS formed relative to the substrate and applying one or more electrical probes to the first MEMS device; providing power to the first MEMS device through the one or more electrical probes; measuring output signals of the first MEMS device; applying a force to the first MEMS device using a force actuator; measuring a set of output signals of the first MEMS device based on the applied force; and processing test data and generating output test results according to the test specification and test program.
A method of automated volume electromechanical testing of MEMS devices on a wafer level comprising steps of:
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