B81C 2201/117
Using supercritical fluid
Official title: Using supercritical fluid, e.g. carbon dioxide, for removing sacrificial layers
B81C2201/117 (Using supercritical fluid) appears on 19 US grants and 22 published applications in this corpus.
Search patents in B81C- Granted patents
- 19
- Published applications
- 22
- Assignees
- 21
- Inventors
- 54
- Latest grant
- 18 Nov 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 6 |
| 2004 | 2 | 6 |
| 2005 | 4 | 6 |
| 2006 | 1 | 1 |
| 2007 | 2 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method and apparatus for etching the silicon oxide layer of a semiconductor substrate18 Nov 2014US 8,889,563 B2Pukyong National University Industry-University Cooperation Foundation
- Process for producing structural body and etchant for silicon oxide film2 Mar 2010US 7,670,496 B2Mitsubishiki Gas Chemical Company, Inc.
- Method for stripping sacrificial layer in MEMS assembly7 Oct 2008US 7,432,572 B2Texas Instruments Incorporated
- Vapor phase etching MEMS devices9 Oct 2007US 7,279,431 B2Semitool, Inc.
- Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations9 Jan 2007US 7,160,815 B2Advanced Technology Materials, Inc.
- Substrate Processing Method and Solvent Used for Same Method8 Nov 2018US 2018/0323076 A1Central Glass Company, Limited
- Method and apparatus for etching the silicon oxide layer of a semiconductor substrate2 Aug 2012US 2012/0196445 A1Pukyong National University
- Method for Depositing an Anti-Adhesion Layer1 Jan 2009US 2009/0004388 A1
- Method for stripping sacrificial layer in MEMS assembly19 Jan 2006US 2006/0014312 A1Texas Instruments Incorporated
- Process for producing structural body and etchant for silicon oxide film22 Sep 2005US 2005/0205515 A1Mitsubishiki Gas Chemical Company, Inc.
Most cited
By later US patents
- Method of unsticking components of micro-mechanical devices117US 5,482,564 ATexas Instruments Incorporated · 1996
- Method and product for fabricating a resonant-bridge microaccelerometer114US 4,893,509 AGeneral Motors Corporation · 1990
- Method of cleaning and treating a semiconductor device including a micromechanical device97US 6,024,801 ATexas Instruments Incorporated · 2000
- Method for preventing micromechanical structures from adhering to another object36US 5,766,367 ASandia Corporation · 1998
- Method for the manufacture of a thin film actuated mirror array34US 6,203,715 B1Daewoo Electronics Co., Ltd. · 2001