Substrate Processing Method and Solvent Used for Same Method
AssigneeCentral Glass Company, Limited
InventorsAkifumi YAO, Soichi KUMON, Masaki FUJIWARA, Hidehisa NANAI
Life of this patent
Estimating the term…
Abstract
A processing method of a semiconductor substrate according the present invention includes: cleaning a surface of the semiconductor substrate with a water-based cleaning liquid; and drying the semiconductor substrate by replacing the water-based cleaning liquid attached to the surface of the semiconductor substrate with a supercritical fluid, characterized by using as the supercritical fluid a C2-C6 fluoroalcohol-containing solvent whose Fe, Ni, Cr, Al, Zn, Cu, Mg, Li, K, Na and Ca contents are each 500 mass ppb or less. In this processing method, it is possible to reduce the amount of fluorine atoms released in the supercritical fluid.
Claims20
A processing method of a semiconductor substrate, comprising:
- cleaning a surface of the semiconductor substrate with a water-based cleaning liquid;
- and
- drying the semiconductor substrate by replacing the cleaning liquid adhered to the surface of the semiconductor substrate with a supercritical fluid,
- wherein the supercritical fluid is of a fluoroalcohol-containing solvent which contains a C2-C6 fluoroalcohol and whose Fe, Ni, Cr, Al, Zn, Cu, Mg, Li, K, Na and Ca contents are each 500 mass ppb or less.
-8. (canceled)
-39. (canceled)
Dependencies are inferred from the claim text.