Method for Depositing an Anti-Adhesion Layer
OwnerFranz Larmer, Ralf Reichenbachinventors
Life of this patent
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Abstract
A method for depositing an anti-adhesion layer onto a surface of micromechanical structures on a substrate. The material or precursor material to be deposited being delivered to the structures in a dissolution and transport medium. A supercritical CO2 fluid is present as the dissolution and transport medium. Deposition of the material or precursor material is brought about by a change in the physical state of the CO2 fluid or by a surface reaction between the surface and the precursor material. The method makes possible subsequent coating of the micromechanical structures in a cavity after encapsulation thereof, the material to be deposited being delivered via access channels or perforation holes.
Claims11
1-10. (canceled)
A method for depositing an anti-adhesion layer onto a surface of micromechanical structures on a substrate, comprising:
- delivering one of a material and a precursor material to be deposited to the structures in a dissolution and transport medium, wherein:
- upon delivery, supercritical CO2 fluid is present as the dissolution and transport medium, and
- deposition of the one of the material and the precursor material is brought about by one of a change in a physical state of the CO2 fluid and a surface reaction between the surface and the precursor material.
Dependencies are inferred from the claim text.