B81C 1/00809
Methods to avoid chemical alteration not provided for in groups b81c1/00793 -
Official title: {Methods to avoid chemical alteration not provided for in groups B81C1/00793 - B81C1/00801}
B81C1/00809 (Methods to avoid chemical alteration not provided for in groups b81c1/00793 -) appears on 3 US grants and 4 published applications in this corpus.
Search patents in B81C- Granted patents
- 3
- Published applications
- 4
- Assignees
- 5
- Inventors
- 18
- Latest grant
- 26 May 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
By publication year.
Recent patents
- Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head26 May 2020US 10,661,566 B2Canon Kabushiki Kaisha
- Method of fabricating a MEMS device25 Apr 2017US 9,632,308 B2Texas Instruments Incorporated
- Passivation layer for harsh environments and methods of fabrication thereof12 Jan 2016US 9,233,842 B2Robert Bosch GmbH
- Amorphous thin metal film25 Apr 2019US 2019/0119101 A1Hewlett-Packard Development Company, L. P.
- Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head4 Oct 2018US 2018/0281414 A1Canon Kabushiki Kaisha
- Method of fabricating a mems device13 Oct 2016US 2016/0299334 A1Texas Instruments Incorporated
- Passivation layer for harsh environments and methods of fabrication thereof18 Sep 2014US 2014/0264781 A1Robert Bosch GmbH
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.