Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head
AssigneeCanon Kabushiki Kaisha
InventorsYoshiyuki Fukumoto, Atsunori Terasaki, Ryoji Kanri, Atsushi Hiramoto
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Abstract
A method for manufacturing a bonded substrate body in which an end portion of an adhesive is located at a position retreated in a direction to the inside of the bonded substrate body from an end surface of a bonding region of a first substrate and a second substrate includes forming a film on the end portion of the adhesive.
Claims20
A method for manufacturing a bonded substrate body in which a first substrate and a second substrate are bonded through an adhesive and which has a film formed on the bonded substrate body over the first substrate, the second substrate, and a bonding region of the first substrate and the second substrate, the method comprising:
- forming the film to the bonding region in which an end portion of the adhesive is located at a position retreated in a direction to an inside of the bonded substrate body from an end surface of the bonding region,
- removing at least one part of the adhesive after bonding the first substrate and the second substrate, and then
- retreating the end portion of the adhesive in the direction to the inside of the bonded substrate body relative to the end surface of the bonding region.
A method for manufacturing a bonded substrate body in which a first substrate and a second substrate are bonded through an adhesive and which has a film formed on the bonded substrate body over the first substrate, the second substrate, and a bonding region of the first substrate and the second substrate, the method comprising:
- forming the film to the bonding region in which an end portion of the adhesive is located at a position retreated in a direction to an inside of the bonded substrate body from an end surface of the bonding region,
- wherein a retreating width L from the end surface of the bonding region of the end portion of the adhesive is 2.0×10−2 μm or more and 2.0×102 μm or less.
Dependencies are inferred from the claim text.