B81C 1/0019
Flexible or deformable structures not provided for in groups b81c1/00142 - b81c1/00182
Official title: {Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182}
B81C1/0019 (Flexible or deformable structures not provided for in groups b81c1/00142 - b81c1/00182) appears on 106 US grants and 113 published applications in this corpus.
Search patents in B81C- Granted patents
- 106
- Published applications
- 113
- Assignees
- 87
- Inventors
- 263
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 8 |
| 2003 | 2 | 5 |
| 2004 | 4 | 4 |
| 2005 | 4 | 4 |
| 2006 | 1 | 2 |
| 2007 | 3 | 11 |
| 2008 | 1 | 3 |
| 2009 | 5 | 7 |
| 2010 | 7 | 10 |
| 2011 | 3 | 3 |
| 2012 | 6 | 5 |
| 2013 | 4 | 6 |
| 2014 | 6 | 4 |
| 2015 | 5 | 5 |
| 2016 | 5 | 5 |
| 2017 | 5 | 4 |
| 2018 | 4 | 3 |
| 2019 | 4 | 7 |
| 2020 | 6 | 3 |
| 2021 | 2 | 5 |
| 2022 | 4 | 3 |
| 2023 | 2 | 1 |
| 2024 | 4 | 3 |
| 2025 | 0 | 0 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite spring structure to reinforce mechanical robustness of a mems device29 Sep 2026US 12,747,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Engineered substrates, free-standing semiconductor microstructures, and related systems and methods20 Jan 2026US 12,528,696 B2Lawrence Semiconductor Research Laboratory, Inc.
- Composite spring structure to reinforce mechanical robustness of a MEMS device28 May 2024US 11,993,510 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Engineered substrates, free-standing semiconductor microstructures, and related systems and methods9 Apr 2024US 11,952,268 B2Lawrence Semiconductor Research Laboratory, Inc.
- Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits12 Mar 2024US 11,926,524 B1Iowa State University Research Foundation, Inc.
- Engineered substrates, free-standing semiconductor microstructures, and related systems and methods23 Apr 2026US 2026/0109595 A1Lawrence Semiconductor Research Laboratory, Inc.
- Method of manufacturing a layered structure for a mems apparatus and mems apparatus with such a layered structure15 Jan 2026US 2026/0016683 A1OQmented GmbH
- Composite spring structure to reinforce mechanical robustness of a mems device15 Aug 2024US 2024/0270565 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Engineered substrates, free-standing semiconductor microstructures, and related systems and methods27 Jun 2024US 2024/0208805 A1Lawrence Semiconductor Research Laboratory, Inc.
- Mems device and manufacturing method thereof21 Mar 2024US 2024/0092632 A1Rohm Co., Ltd.
Most cited
By later US patents
- Compound stage MEM actuator suspended for multidimensional motion127US 5,536,988 ACornell Research Foundation, Inc. · 1996
- Microelectromechanical systems (MEMS) device including a superlattice115US 7,586,165 B2Mears Technologies, Inc. · 2009
- Method for fabricating a multi-layer capacitor and a multi-layer capacitor85US 8,861,184 B2Max-Planck-Gesellschaft Zur FöRderung Der Wissenschaften E. V. · 2014
- Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices77US 7,211,464 B2President and Fellows of Harvard College · 2007
- Multilayered wafer with thick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof71US 6,277,712 B1Samsung Electronics Co., Ltd. · 2001