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US 8,861,184 B2Granted
Method for fabricating a multi-layer capacitor and a multi-layer capacitor
AssigneeMax-Planck-Gesellschaft zur Forderung der Wissenschaften e.V.
InventorOliver G. Schmidt
Life of this patent
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Abstract
The method comprises fabricating a layer stack on a substrate, the layer stack comprising at least two electrically conducting layers and at least one electrically insulating layer arranged between the two electrically conducting layers, and displacing a first portion of the layer stack away from its original position, the first portion comprising an edge portion of the layer stack, and bending the first portion back towards a second portion of the layer stack. The bending may comprise a rolling-up of the first portion of the layer stack.
Claims9
A capacitor comprising:
- a substrate;
- and
- a layer stack comprising at least two electrically conducting layers and at least one electrically insulating layer arranged between the two electrically conducting layers, wherein the layer stack comprises two spatially predominant portions, namely
- a first portion of the layer stack which is bent into a direction away from the substrate and is rolled-up and
- a second portion of the layer stack which is planar.
2 more elements
Dependencies are inferred from the claim text.