B23K 20/007
Ball bonding
Official title: {Ball bonding}
B23K20/007 (Ball bonding) appears on 355 US grants and 227 published applications in this corpus.
Search patents in B23K- Granted patents
- 355
- Published applications
- 227
- Assignees
- 125
- Inventors
- 685
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 8 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 10 | 0 |
| 1992 | 12 | 0 |
| 1993 | 14 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 11 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 17 | 0 |
| 2000 | 12 | 0 |
| 2001 | 11 | 4 |
| 2002 | 9 | 7 |
| 2003 | 4 | 15 |
| 2004 | 10 | 10 |
| 2005 | 10 | 19 |
| 2006 | 7 | 13 |
| 2007 | 8 | 7 |
| 2008 | 7 | 9 |
| 2009 | 10 | 8 |
| 2010 | 9 | 15 |
| 2011 | 12 | 18 |
| 2012 | 15 | 7 |
| 2013 | 9 | 13 |
| 2014 | 5 | 4 |
| 2015 | 10 | 14 |
| 2016 | 15 | 7 |
| 2017 | 1 | 3 |
| 2018 | 7 | 6 |
| 2019 | 5 | 8 |
| 2020 | 2 | 2 |
| 2021 | 4 | 6 |
| 2022 | 7 | 10 |
| 2023 | 3 | 8 |
| 2024 | 10 | 4 |
| 2025 | 8 | 8 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wire bonding apparatus and control method8 Sep 2026US 12,728,478 B2Kioxia Corporation
- Apparatus and methods for tool mark free stitch bonding7 Jul 2026US 12,677,378 B2Skyworks Solutions, Inc.
- Annular structure for an electronic flame off wand19 May 2026US 12,629,761 B2SanDisk Technologies LLC
- Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point19 May 2026US 12,635,080 B2SanDisk Technologies LLC
- Wire bonding system, inspection device, wire bonding method, and recording medium2 Dec 2025US 12,489,003 B2Yamaha Robotics Co., Ltd.
- Wire bonding tools, and related methods of providing the same14 May 2026US 2026/0131395 A1Kulicke and Soffa Industries, Inc.
- Wire bonding apparatus16 Apr 2026US 2026/0107809 A1Samsung Electronics Co., Ltd.
- Wire bonding apparatus and control method25 Sep 2025US 2025/0300122 A1Kioxia Corporation
- Wire bonding apparatus, operation method, and control method25 Sep 2025US 2025/0300123 A1Kioxia Corporation
- Methods of forming wire interconnect structures and related wire bonding tools24 Jul 2025US 2025/0239567 A1Kulicke and Soffa Industries, Inc.
Most cited
By later US patents
- Method of making temporary connections between electronic components207US 5,832,601 AForm Factor, Inc. · 1998
- Angled flying lead wire bonding process186US 6,295,729 B1International Business Machines Corporation · 2001
- Angled flying lead wire bonding process177US 6,708,403 B2International Business Machines Corporation · 2004
- Angled flying lead wire bonding process172US 6,526,655 B2International Business Machines Corporation · 2003
- Ball bonding method and apparatus for performing the method130US 4,925,083 AEmhart Deutschland GmbH · 1990