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US 12,489,003 B2Granted
Wire bonding system, inspection device, wire bonding method, and recording medium
AssigneeYamaha Robotics Co., Ltd.
InventorHiroyuki Kasama
Life of this patent
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Abstract
A wire bonding system according to the present invention comprises: an acquisition unit that acquires information pertaining to the diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding; a first storage unit that stores the information pertaining to the pressure-bonded ball diameter which has been acquired by the acquisition unit; and an inspection unit that inspects the quality of wire bonding on the basis of the information pertaining to the pressure-bonded ball diameter which has been read from the first storage unit. With the wire bonding system, it is possible to enhance convenience in a method for checking the quality of wire bonding.
Claims8
A wire bonding system, comprising:
- an acquisition unit that acquires information pertaining to a diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding, wherein the information pertaining to the diameter of the pressure-bonded ball comprises a pressing amount of a ball portion at a tip of the wire against the electronic component during wire bonding;
- a first storage unit that stores the information pertaining to the diameter of the pressure-bonded ball acquired by the acquisition unit;
- an inspection unit that inspects quality of wire bonding based on the information pertaining to the diameter of the pressure-bonded ball read from the first storage unit;
- a criterion setting unit that sets an inspection criterion for the information pertaining to the diameter of the pressure-bonded ball, and
- a second storage unit that stores correlation data indicating a correlation between the pressing amount of the ball portion and the diameter of the pressure-bonded ball,
- wherein the criterion setting unit sets a threshold value for the pressing amount of the ball portion as the inspection criterion by referring to the correlation data read from the second storage unit, based on preset standard data of the diameter of the pressure-bonded ball,
- wherein the inspection unit inspects the quality of wire bonding by comparing the pressing amount of the ball portion acquired by the acquisition unit with the threshold value set by the criterion setting unit.
4 more elements
An inspection device, comprising:
- an acquisition unit that acquires information pertaining to a diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding, wherein the information pertaining to the diameter of the pressure-bonded ball comprises a pressing amount of a ball portion at a tip of the wire against the electronic component during wire bonding;
- a first storage unit that stores the information pertaining to the diameter of the pressure-bonded ball acquired by the acquisition unit;
- an inspection unit that inspects quality of wire bonding based on the information pertaining to the diameter of the pressure-bonded ball read from the first storage unit;
- a criterion setting unit that sets an inspection criterion for the information pertaining to the diameter of the pressure-bonded ball, and
- a second storage unit that stores correlation data indicating a correlation between the pressing amount of the ball portion and the diameter of the pressure-bonded ball,
- wherein the criterion setting unit sets a threshold value for the pressing amount of the ball portion as the inspection criterion by referring to the correlation data read from the second storage unit, based on preset standard data of the diameter of the pressure-bonded ball,
- wherein the inspection unit inspects the quality of wire bonding by referring to the inspection criterion set by the criterion setting unit, based on the information pertaining to the diameter of the pressure-bonded ball acquired by the acquisition unit.
4 more elements
A wire bonding method, comprising:
- acquiring information pertaining to a diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding, wherein the information pertaining to the diameter of the pressure-bonded ball comprises a pressing amount of a ball portion at a tip of the wire against the electronic component during wire bonding;
- storing the acquired information pertaining to the diameter of the pressure-bonded ball in a first storage unit;
- inspecting quality of wire bonding based on the information pertaining to the diameter of the pressure-bonded ball read from the first storage unit;
- setting an inspection criterion for the information pertaining to the diameter of the pressure-bonded ball, and
- storing correlation data indicating a correlation between the pressing amount of the ball portion and the diameter of the pressure-bonded ball in a second storage unit,
- wherein in the setting of the inspection criterion, setting a threshold value for the pressing amount of the ball portion as the inspection criterion by referring to the correlation data read from the second storage unit, based on preset standard data of the diameter of the pressure-bonded ball,
- wherein the inspection unit inspects the quality of wire bonding by referring to the inspection criterion, based on the information pertaining to the diameter of the pressure-bonded ball.
4 more elements
A non-transient computer-readable recording medium, recording a program for one or more computers to execute:
- acquiring information pertaining to a diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding, wherein the information pertaining to the diameter of the pressure-bonded ball comprises a pressing amount of a ball portion at a tip of the wire against the electronic component during wire bonding;
- storing the acquired information pertaining to the diameter of the pressure-bonded ball in a first storage unit;
- inspecting quality of wire bonding based on the information pertaining to the diameter of the pressure-bonded ball read from the first storage unit;
- setting an inspection criterion for the information pertaining to the diameter of the pressure-bonded ball, and
- storing correlation data indicating a correlation between the pressing amount of the ball portion and the diameter of the pressure-bonded ball in a second storage unit,
- wherein in the setting of the inspection criterion, setting a threshold value for the pressing amount of the ball portion as the inspection criterion by referring to the correlation data read from the second storage unit, based on preset standard data of the diameter of the pressure-bonded ball,
- wherein the inspection unit inspects the quality of wire bonding by referring to the inspection criterion, based on the information pertaining to the diameter of the pressure-bonded ball.
4 more elements
Dependencies are inferred from the claim text.