B23K 20/005
Capillary welding
Official title: {Capillary welding}
B23K20/005 (Capillary welding) appears on 608 US grants and 383 published applications in this corpus.
Search patents in B23K- Granted patents
- 608
- Published applications
- 383
- Assignees
- 183
- Inventors
- 1,030
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 7 | 0 |
| 1984 | 10 | 0 |
| 1985 | 4 | 0 |
| 1986 | 13 | 0 |
| 1987 | 10 | 0 |
| 1988 | 14 | 0 |
| 1989 | 10 | 0 |
| 1990 | 11 | 0 |
| 1991 | 15 | 0 |
| 1992 | 17 | 0 |
| 1993 | 17 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 15 | 0 |
| 1997 | 10 | 0 |
| 1998 | 12 | 0 |
| 1999 | 32 | 0 |
| 2000 | 27 | 0 |
| 2001 | 23 | 6 |
| 2002 | 18 | 18 |
| 2003 | 15 | 24 |
| 2004 | 14 | 20 |
| 2005 | 19 | 31 |
| 2006 | 11 | 24 |
| 2007 | 14 | 19 |
| 2008 | 16 | 18 |
| 2009 | 14 | 15 |
| 2010 | 16 | 24 |
| 2011 | 19 | 25 |
| 2012 | 18 | 13 |
| 2013 | 14 | 14 |
| 2014 | 10 | 5 |
| 2015 | 12 | 19 |
| 2016 | 17 | 11 |
| 2017 | 5 | 9 |
| 2018 | 15 | 11 |
| 2019 | 9 | 11 |
| 2020 | 6 | 5 |
| 2021 | 8 | 10 |
| 2022 | 10 | 17 |
| 2023 | 9 | 13 |
| 2024 | 22 | 8 |
| 2025 | 9 | 8 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wire bonding apparatus and control method8 Sep 2026US 12,728,478 B2Kioxia Corporation
- Wire bonding systems and related methods of forming a vertical wire structure21 Jul 2026US 12,686,071 B2Kulicke and Soffa Industries, Inc.
- Apparatus and methods for tool mark free stitch bonding7 Jul 2026US 12,677,378 B2Skyworks Solutions, Inc.
- Annular structure for an electronic flame off wand19 May 2026US 12,629,761 B2SanDisk Technologies LLC
- Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point19 May 2026US 12,635,080 B2SanDisk Technologies LLC
- Pneumatic wire threading device and method27 Aug 2026US 2026/0249381 A1Asmpt Singapore Pte. Ltd.
- Automatic bonding tool replacement apparatus and method21 May 2026US 2026/0138204 A1Asmpt Singapore Pte. Ltd.
- Wire bonding tools, and related methods of providing the same14 May 2026US 2026/0131395 A1Kulicke and Soffa Industries, Inc.
- Wire bonding apparatus16 Apr 2026US 2026/0107809 A1Samsung Electronics Co., Ltd.
- Wire bonding systems and related methods of forming a vertical wire structure29 Jan 2026US 2026/0027644 A1Kulicke and Soffa Industries, Inc.
Most cited
By later US patents
- Method of making temporary connections between electronic components207US 5,832,601 AForm Factor, Inc. · 1998
- Angled flying lead wire bonding process186US 6,295,729 B1International Business Machines Corporation · 2001
- Angled flying lead wire bonding process177US 6,708,403 B2International Business Machines Corporation · 2004
- Angled flying lead wire bonding process172US 6,526,655 B2International Business Machines Corporation · 2003
- Method for fabricating semiconductor components with through wire interconnects153US 7,371,676 B2Micron Technology, Inc. · 2008