Wire bonding systems and related methods of forming a vertical wire structure

A wire bonding system comprising:

• a bond head assembly configured to carry a wire bonding tool, the bond head assembly including a first wire clamp, the wire bonding tool and the first wire clamp being configured to move together along a z-axis of the wire bonding system;
• a support structure configured to support a workpiece, the workpiece being configured for wire bonding;
• a movable stage assembly including a movable stage configured to move with respect to the wire bonding tool, the wire bonding tool being configured to press a wire engaged with the wire bonding tool against the movable stage to create a deformed portion of the wire, wherein an end portion of the wire extends from the deformed portion;
• and
• a second wire clamp, the second wire clamp being stationary with respect to the wire bonding tool and the first wire clamp along the z-axis,
• wherein the first wire clamp is configured to be closed and move downward along the z-axis, with the second wire clamp open, to advance the end portion of the wire prior to formation of the deformed portion of the wire,
• wherein the first wire clamp is configured to be open and move downward along the z-axis, with the second wire clamp closed, to at least partially straighten the end portion of the wire after formation of the deformed portion of the wire,
• wherein the movable stage is configured to move to a retracted position away from the wire bonding tool simultaneously with downward motion of the first wire clamp along the z-axis after formation of the deformed portion of the wire.