Shellcase Ltd.
Jerusalem, IL· latest recorded location
Shellcase Ltd. is named on 9 US grants and 2 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 9
- Published applications
- 2
- Inventors
- 7
- Granted in 2026 so far
- 0
- Most recent grant
- 6 Dec 2005
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 1 |
By publication year.
Technology areas
Share of 11 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by9
- H10FSolar cells and light sensors5
- H10HInorganic light-emitting semiconductor devices having potential barriers4
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered3
- B29CShaping or joining of plastics1
- B81BMicrostructural devices or systems1
- B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural1
- C09JAdhesives1
- G03FPhotomechanical production of textured or patterned surfaces1
- H03HImpedance networks1
Recent patents
- Methods and apparatus for packaging integrated circuit devices6 Dec 2005US 6,972,480 B2
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby17 Aug 2004US 6,777,767 B2
- Integrated circuit device11 Nov 2003US 6,646,289 B1
- Packaged integrated circuits and methods of producing thereof23 Sep 2003US 6,624,505 B2
- Methods of producing integrated circuit devices12 Sep 2000US 6,117,707 A
Most cited
By later US patents
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby157US 6,777,767 B22004
- Methods and apparatus for packaging integrated circuit devices150US 6,972,480 B22005
- Process for manufacturing solder leads on a semiconductor device package137US 6,022,758 A2000
- Packaged integrated circuits and methods of producing thereof128US 6,624,505 B22003
- Methods and apparatus for producing integrated circuit devices121US 6,040,235 A2000