Methods and apparatus for producing integrated circuit devices

A method for producing integrated circuit devices including the steps of:

• producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads;
• and
• thereafter partially cutting the wafer, thereby to define notches along outlines of a plurality of integrated circuits thereby exposing sectional surfaces of the multiplicity of pads.

Apparatus for producing integrated circuit devices including:

• apparatus for producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads;
• and
• partially cutting apparatus for thereafter partially cutting the wafer, thereby to define notches along outlines of a plurality of integrated circuit elements which expose sectional surfaces of the multiplicity of pads.

An integrated circuit device comprising:

• an integrated circuit die having top and bottom surfaces formed of electrically insulative and mechanically protective material and electrically insulative edge surfaces having exposed sections of conductive pads and being inclined with respect to the top and bottom surfaces.