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US 6,646,289 B1Granted
Integrated circuit device
AssigneeShellcase Ltd.
InventorAvner Badehi
Life of this patent
Estimating the term…
Abstract
An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces (317) being transparent to radiation, and electrically insulative edge surfaces (314) having pads.
Claims23
An integrally packaged optronic integrated circuit device including:
- an integrated circuit die containing:
- at least one of a radiation emitter and radiation receiver, said integrated circuit die having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces being transparent to radiation;
- and electrically insulative edge surfaces having pads,
- the pads comprising contacts extending onto said at least one of the top and bottom surfaces.
1 more element
A method for producing an integrally packaged optronic integrated surface device comprising the steps of:
- forming electrical circuits onto a semiconductor wafer;
- forming at least one transparent mechanical protective layer onto said semiconductor wafer over said electrical circuits;
- forming solderable contacts onto said semiconductor wafer;
- and
- thereafter, dicing said wafer into individual packages dies,
- wherein said mechanical protective layer comprises at least one planar surface and wherein said step of forming at least one transparent mechanical protective layer comprises providing contacts extending onto the at least one planar surface.
3 more elements
Dependencies are inferred from the claim text.