Methods of producing integrated circuit devices
AssigneeShellcase Ltd.
InventorPeirre Badehi
Life of this patent
Estimating the term…
Abstract
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described and claimed.
Claims17
A method of producing prepackaged integrated circuit devices comprising the steps of:
- providing a wafer having a first surface and a second surface generally parallel to and oppositely directed with respect to said first surface;
- producing a plurality of integrated circuit dies on said first surface of said wafer, each of the integrated circuit dies comprising a multiplicity of pads;
- attaching a first electrically insulative plate to said plurality of integrated circuit dies on the first surface of said wafer;
- attaching a second insulative plate to said second surface of said wafer, at least one of said insulative plates being transparent to radiation in an optical or infra-red spectral range;
- separating the integrated circuit dies from each other so as to define edges thereof while the dies remain attached to the insulative plates;
- generally surrounding said integrated circuits on said edges and said second surface with a protective sealant;
- and
- thereafter slicing the wafer and protective sealant and the insulative plates attached thereto, thereby to define a plurality of prepackaged integrated circuit devices.
A method of producing prepackaged integrated circuit devices comprising the steps of:
- providing a wafer having a first surface and a second surface generally parallel to and oppositely directed with respect to said first surface;
- producing a plurality of integrated circuit dies on said first surface of said wafer, each of the integrated circuit dies comprising a multiplicity of pads;
- attaching a first electrically insulative plate to said plurality of integrated circuit dies on the first surface of said wafer;
- separating the integrated circuit dies from each other so as to define edges thereof while the dies remain attached to the insulative plate;
- generally surrounding said integrated circuit dies on said edges with a protective sealant;
- attaching a second insulative plate to said plurality of integrated circuit dies on said second surface of said wafer, at least one of said insulative plates being transparent to radiation in an optical or infra-red spectral range;
- and
- thereafter slicing the wafer and protective sealant and the insulative plates attached thereto, thereby to define a plurality of prepackaged integrated circuit devices.
A method of producing prepackaged integrated circuit devices comprising the steps of:
- providing a wafer having a first surface and a second surface generally parallel to and oppositely directed with respect to said first surface;
- attaching an insulative plate to said second surface of said wafer, said insulative plate being transparent to radiation in an optical or infra-red spectral range;
- producing a plurality of integrated circuit dies on said first surface of said wafer, each of the integrated circuit dies comprising a multiplicity of aluminum pads;
- exposing the multiplicity of pads;
- and
- applying anti-corrosion treatment to the multiplicity of pads, by employing a chromating solution.
Dependencies are inferred from the claim text.