Methods and apparatus for packaging integrated circuit devices
AssigneeShellcase Ltd.
InventorsGil Zilber, Reuven Katraro, Julia Aksenton, Vage Oganesian
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Abstract
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.
Claims11
An integrally packaged integrated circuit device comprising:
- an integrated circuit die comprising:
- a crystalline substrate having first and second generally planar surfaces and edge surfaces;
- and
- an active surface formed on said first generally planar surface;
- at least one chip scale packaging layer formed over said active surface;
- at least one gap formed between said crystalline substrate and said at least one chip scale packaging layer;
- and
- at least one electrical contact formed over said at least one chip scale packaging layer, said at least one electrical contact being connected to circuitry on said active surface by at least one pad formed on said first generally planar surface.
Dependencies are inferred from the claim text.