Y10T 156/1939
Air blasting delaminating means]
Y10T156/1939 (Air blasting delaminating means]) appears on 86 US grants and 74 published applications in this corpus.
Search patents in Y10T- Granted patents
- 86
- Published applications
- 74
- Assignees
- 52
- Inventors
- 138
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 6 | 7 |
| 2003 | 4 | 5 |
| 2004 | 2 | 2 |
| 2005 | 6 | 3 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 3 |
| 2009 | 2 | 4 |
| 2010 | 3 | 2 |
| 2011 | 1 | 4 |
| 2012 | 3 | 2 |
| 2013 | 6 | 6 |
| 2014 | 3 | 4 |
| 2015 | 3 | 5 |
| 2016 | 6 | 6 |
| 2017 | 5 | 2 |
| 2018 | 6 | 2 |
| 2019 | 4 | 3 |
| 2020 | 2 | 8 |
| 2021 | 6 | 1 |
| 2022 | 4 | 2 |
| 2023 | 2 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Wafer separation apparatus and method, and method for manufacturing silicon wafer2 Sep 2025US 12,406,863 B2Sumco Corporation
- Detaching a die from an adhesive tape by air ejection19 Sep 2023US 11,764,098 B2Asmpt Singapore Pte. Ltd.
- Protective sheet automatic peeling apparatus and protective sheet automatic peeling method18 Apr 2023US 11,629,028 B2Nippi, Incorporated
- Method of peeling protective sheet for prepreg sheet and apparatus for peeling protective sheet from prepreg sheet17 May 2022US 11,331,898 B2Mitsubishi Heavy Industries, Ltd.
- Peeling method and method of manufacturing semiconductor device5 Apr 2022US 11,296,131 B2Semiconductor Energy Laboratory Co.Ltd.
- Wafer separation apparatus and method, and method for manufacturing silicon wafer27 Jun 2024US 2024/0213050 A1Sumco Corporation
- Detaching a die from an adhesive tape by air ejection20 Oct 2022US 2022/0336254 A1Asm Technology Singapore Pte Ltd
- Protective sheet automatic peeling apparatus and protective sheet automatic peeling method28 Apr 2022US 2022/0127102 A1Nippi, Incorporated
- Protective sheet automatic peeling apparatus and protective sheet automatic peeling method28 Jan 2021US 2021/0024324 A1Nippi, Incorporated
- Method of peeling protective sheet for prepreg sheet and apparatus for peeling protective sheet from prepreg sheet17 Dec 2020US 2020/0391497 A1Mitsubishi Heavy Industries, Ltd.
Most cited
By later US patents
- Peeling method and method of manufacturing semiconductor device137US 7,351,300 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Substrate cleaving tool and method70US 6,221,740 B1Silicon Genesis Corporation · 2001
- Method and apparatus for separating composite member using fluid50US 6,382,292 B1Canon Kabushiki Kaisha · 2002
- Method of peeling thin film device and method of manufacturing semiconductor device using peeled thin film device42US 7,825,002 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Separating apparatus and processing method for plate member36US 6,946,052 B2Canon Kabushiki Kaisha · 2005