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US 12,406,863 B2Granted
Wafer separation apparatus and method, and method for manufacturing silicon wafer
AssigneeSumco Corporation
InventorsTomohiro Hashii, Tsukasa Yoshihara, Yasunori Yoshioka, Kawahito Shinichi, Sumihisa Masuda
Life of this patent
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Abstract
It would be helpful to provide a wafer separation apparatus and method, and a method for manufacturing a silicon wafer in which poor wafer separation can be easily prevented. A wafer separation apparatus 1 includes an injection port 2 configured to inject a fluid, a rolling element 3, and a holder 4 configured to movably hold the rolling element 3 in a rollable and integral manner, to be reciprocatable and biased to one side in a reciprocating direction, and to be integrally connected to the injection port 2.
Claims6
A wafer separation apparatus comprising:
- an injection port configured to inject a fluid;
- a rolling element;
- and
- a holder configured to movably hold the rolling element in a rollable and integral manner, to be reciprocatable and biased to one side in a reciprocating direction, and to be integrally connected to the injection port.
1 more element
Dependencies are inferred from the claim text.