Y10T 156/1928
Differential fluid pressure delaminating means
Y10T156/1928 (Differential fluid pressure delaminating means) appears on 400 US grants and 375 published applications in this corpus.
Search patents in Y10T- Granted patents
- 400
- Published applications
- 375
- Assignees
- 215
- Inventors
- 770
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 1 |
| 2002 | 9 | 12 |
| 2003 | 8 | 9 |
| 2004 | 4 | 12 |
| 2005 | 9 | 14 |
| 2006 | 4 | 11 |
| 2007 | 9 | 12 |
| 2008 | 8 | 15 |
| 2009 | 6 | 15 |
| 2010 | 15 | 15 |
| 2011 | 16 | 27 |
| 2012 | 19 | 15 |
| 2013 | 21 | 25 |
| 2014 | 18 | 29 |
| 2015 | 20 | 30 |
| 2016 | 34 | 32 |
| 2017 | 34 | 20 |
| 2018 | 24 | 14 |
| 2019 | 21 | 13 |
| 2020 | 11 | 14 |
| 2021 | 12 | 12 |
| 2022 | 17 | 8 |
| 2023 | 7 | 7 |
| 2024 | 6 | 6 |
| 2025 | 3 | 3 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Peeling system and peeling method for flexible fingerprint component14 Jul 2026US 12,679,083 B2Beijing BOE Sensor Technology Co., Ltd.
- Systems and methods of automatic film removal12 May 2026US 12,623,368 B2General Electric Company
- Composite backing layer peel starter12 May 2026US 12,623,449 B2The Boeing Company
- Substrate processing apparatus and substrate processing method5 May 2026US 12,622,206 B2Tokyo Electron Limited
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same5 May 2026US 12,622,207 B2Adeia Semiconductor Bonding Technologies Inc.
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate processing apparatus and substrate processing method13 Aug 2026US 2026/0239913 A1Tokyo Electron Limited
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Systems and methods of automatic film removal24 Apr 2025US 2025/0128444 A1General Electric Company
Most cited
By later US patents
- Peeling method and method of manufacturing semiconductor device137US 7,351,300 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Apparatus for preparing tissue sections71US 4,752,347 A1988
- Nozzle for cleaving substrates71US 6,263,941 B1Silicon Genesis Corporation · 2001
- Substrate cleaving tool and method70US 6,221,740 B1Silicon Genesis Corporation · 2001
- Nozzle for cleaving substrates68US 6,513,564 B2Silicon Genesis Corporation · 2003